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MSCLE266-F

MSCLE266-F

詳細規格:

MSCLE266-F

VIA CLE266 chipset

Socket 370 Processor Based Flex ATX Motherboard With VGA/Audio/Lan/USB 2.0 On Board

Feature

Processor

 

Built-in VIA C3 2000+ CPU

Chipset

 

VIA CLE266 (VT8623/VT8235) two chip AGPset
Supports 66/100/133 MHz Front Side Bus
V-Link 266MB/s high bandwidth North/South Bridge interconnect

Memory

 

Supports two 184-pin DDR DIMM maximum size up to 2GB.
Support DIMMs of DDR200/DDR266.

Embedded 3D Ultra AGP VGA

 

Integrated UniChrome? 2D/3D graphics
Shared memory architecture allows a maximum of 64 MB main memory to act as frame buffer

Embedded USB2.0  

 

480 Mbps data capacity
Backwards compatible with USB 1.1
Compliant with Intel!|s Enhanced Host Controller Interface
Specification Revision 0.95

Embedded LAN on board

 

10/100Mbps Fast Ethernet LAN on board
Supports IEEE 802.3 and 802.3u standards
Fully compliant ANSI X3.263 TP-PMD physical sub-layer

Audio

 

AC97 Codec on board to provide software audio solution
6CH DAC, applicable for leading motherboard chipsets.
Extensive jack-detection capability
Precise and advanced impedance sensing
Support 2 stereo microphones recording and playback

Two Ultra DMA IDE Ports

 

Supports two IDE ports up to 4 ATAPI devices
Supports up to PIO Mode 4 up to 16.6MBps, Multi Mode 4 up to 133MBps with bus mastering

Bus Architecture

 

One CNR (Communication Network Riser)
Two PCI 2.2 32-bit Master PCI Bus slots

I/O Interface

 

PS/2 Mini-DIN mouse & keyboard ports
Six USB ports (four backpanel ports, onboard USB headers providing two extra ports)
One 25-pin female printer port
One serial port
One VGA port
Audio I/O: LINE-Outx1 , LINE-Inx1, MIC JACK

Form Factor

 

Four layers, 23.0 cm x 17.0 cm
Flex ATX form factor

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